Intel is now well along with the work with the D1X factory to get a new 7nm process up and running. Intel is also intending to upgrade their Ireland and Israeli facilities as well.
D1X was built in 2010 making it the world’s largest semiconductor factory.
Intel is intending to use EUV to manufacture the waters which is the way TSMC is moving with their lines.
Intel has had problems with 10nm mostly due to poor yields. Perhaps EUV will help that process with some new refinements. EUV has the undesirable requirement of needing hyper clean air.
ASML is now expected to ship closer to 30 machines ahead of earlier expectations in 2018. Last year ASML shipped (only) 18 Twinscan NXE: 3400B EUV scanners. Later this year ASML will introduce its new generation Twinscan NXE: 3400C EUV scanner that will be able to process 170 wafers per hour, up from 155 wafers per hour on the NXE: 3400B.
If Intel can get 7nm yields to acceptable levels they will behind TSMC but Intel has other facilities which they are also working on making 7nm. TSMC is also expected to tape-out some 5nm samples later in 2019.
EUV has been seen as the way forward for the industry as it is the least complicated solution available.